Electronic Assembly Line Auxiliary Systems – Kasion Automation Limited

SE3000-DD & SE3000-D DUAL LANE SPI

Inspection Application (2D+3D)	Solder paste and SMD glue
Inspection speed (2D+3D):	35cm²/sec or 15cm²/sec (depends on MRS sensor type)
Minimum component aperture size:	0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type)
PCB size (Max.):	SE3000-DD: Single Lane: 510x510mm; Dual Lane: 350x320mm SE3000-D: Single Lane: 510x510mm; Dual Lane: 510x320mm
Measurement Gage R&R	<5% or <3%@6σ on Certification Target
Height accuracy	3μm on a Certification Target