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Electronic Assembly Line Auxiliary Systems

Electronic Assembly Line Auxiliary Systems » Cyberoptics » SOLDER PASTE INSPECTION (SPI)

SE500 ULTRA SPI

Inspection Application (2D+3D) Solder paste and SMD glue
Inspection speed (2D+3D): SE500 Ultra: 210cm2/sec @30um; 80cm2/sec @15um
SE500-X: Peak: 108cm2/sec & Average: 80 cm2/sec@30um; Peak: 65cm2/sec & Average: 50 cm2/sec@15um
PCB size: SE500 Ultra: 50x50mm – 510x510mm; SE500-X: 100x100mm – 810x610mm
Measurement Gage R&R SE500 Ultra: <<10% @6σ on Certification Target;
SE500-X: <2%@6σ on Certification Target
Height accuracy 2μm on a Certification Target
CATEGORY
Cyberoptics
SUB-CATEGORY
SOLDER PASTE INSPECTION (SPI)

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