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Electronic Assembly Line Auxiliary Systems

Electronic Assembly Line Auxiliary Systems » Cyberoptics » MEMORY FINAL VISION INSPECTION (FVI)

MX3000 3D AOI MEMORY MODULE INSPECTION

Inspection Application (2D+3D) Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others)
Inspection speed (2D+3D): 50cm2/sec
Minimum component size: 0402mm (01005 in.)
Board length: Min. 25mm / Max. 140mm
Board width: Min. 17mm / Max. 35mm
CATEGORY
Cyberoptics
SUB-CATEGORY
MEMORY FINAL VISION INSPECTION (FVI)

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