Electronic Assembly Line Auxiliary Systems – Kasion Automation Limited

SE3000/SE3000-X/SE3000-XL SOLDER PASTE INSPECTION (SPI)

Inspection Application (2D+3D)	Solder paste and SMD glue
Inspection speed (2D+3D):	Peak: 35cm²/sec & Average: 30 cm²/sec or Peak: 15cm²/sec & Average: 12 cm²/sec (depends on MRS sensor type)
Minimum component aperture size:	0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type)
PCB size:	SE3000: 50x50mm – 510x510mm; SE3000-X: 50x120mm – 720x620mm; SE3000-XL: 50x120mm – 1200x610mm (with 2 index inspection capability)
Measurement Gage R&R	<5% or <3%@6σ on Certification Target
Height accuracy	3μm on a Certification Target