电子组装生产线设备 – Kasion Automation Limited

SE500 ULTRA SPI

Inspection Application (2D+3D)	Solder paste and SMD glue
Inspection speed (2D+3D):	SE500 Ultra: 210cm²/sec @30um; 80cm²/sec @15um SE500-X: Peak: 108cm²/sec & Average: 80 cm²/sec@30um; Peak: 65cm²/sec & Average: 50 cm²/sec@15um
PCB size:	SE500 Ultra: 50x50mm – 510x510mm; SE500-X: 100x100mm – 810x610mm
Measurement Gage R&R	SE500 Ultra: <<10% @6σ on Certification Target; SE500-X: <2%@6σ on Certification Target
Height accuracy	2μm on a Certification Target