• 优秀奖
    2021
  • 最佳工业
    解决方案供应商

SE3000/SE3000-X/SE3000-XL SOLDER PASTE INSPECTION (SPI)

Inspection Application (2D+3D) Solder paste and SMD glue
Inspection speed (2D+3D): Peak: 35cm2/sec & Average: 30 cm2/sec or Peak: 15cm2/sec & Average: 12 cm2/sec (depends on MRS sensor type)
Minimum component aperture size: 0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type)
PCB size: SE3000: 50x50mm – 510x510mm; SE3000-X: 50x120mm – 720x620mm; SE3000-XL: 50x120mm – 1200x610mm (with 2 index inspection capability)
Measurement Gage R&R <5% or <3%@6σ on Certification Target
Height accuracy 3μm on a Certification Target
类别
Cyberoptics
子类别
SOLDER PASTE INSPECTION (SPI)

下载查询表格

    公司 (必填)

    姓名 (必填)

    电邮 (必填)

    联络电话 (必填)

    查询产品

    你的信息

    Primary Color
    default
    green
    orange
    default
    green
    orange