电子组装生产线设备 – Kasion Automation Limited

SE600 SPI

Inspection Application (2D+3D)	Solder paste and SMD glue
Inspection speed (2D+3D):	Peak: 108cm²/sec & Average: 80 cm²/sec@30um; Peak: 56cm²/sec & Average: 30 cm²/sec@15um
PCB size:	SE600: 50x50mm – 510x510mm; SE600-X: 100x100mm – 710x610mm
Measurement Gage R&R	<<2% @6σ on Certification Target
Height accuracy	2μm on a Certification Target