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VisionPro AP Series

VisionPro AP series (Available models: APSP3D, VisionPro AP300 & VisionPro AP500)

VisionPro AP series is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows user interface, and packaged in a rugged, tabletop system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA’s and many other PCB features. VisionPro AP series completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Key Features & Benefits

Multiple Sensor Options: SP3D & PSI
Automated Height, Area, Volume, Offset
Gerber Programming & Auto-Scripting
Defect Error Review
Built-in Data and SPC Charting
Color 3D Profiles of Measured Features
ASCan Ultra Measurement Software

Specifications	APSP3D	VisionPro AP300	VisionPro AP500
Inspection Speed:	60 frames/sec	1 sec FOV 3D	1 sec FOV 3D
Static Repeatability:	2.5um (0.1mil)	1um (0.04mil)	1um (0.04mil)
Z Resolution:	2.54um (0.1mil)	1.78um (0.07mil)	1.78um (0.07mil)
Gauge R&R (±50% tolerance on PCB):	<10%	<10%	<10%
Height Accuracy on Calibration Tool:	2um (0.8mil)	1um (0.04mil)	1um (0.04mil)
Min. Paste Deposit Size:	127um (5mil)	51um (2mil)	51um (2mil)