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Electronic Assembly Line Systems

Electronic Assembly Line Systems » Cyberoptics » 錫膏測厚儀(SPI)

SE600錫膏測厚儀(SPI)

檢測應用 (2D+3D) 錫膏和SMD膠水
檢測速度 (2D+3D): 最高: 108cm2/sec和平均: 80 cm2/sec@30um; 最高: 56cm2/sec和平均: 30 cm2/sec@15um
線路板 : SE600: 50x50mm – 510x510mm;
SE600-X: 100x100mm – 710x610mm
測量 Gage R&R <2%@6σ(使用校正板)
高度精準度: 使用校正板是2um
CATEGORY
Cyberoptics
SUB-CATEGORY
錫膏測厚儀(SPI)

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