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MX3000 3D AOI記憶體成品外觀檢測
| 檢測應用 (2D+3D) | 各種外型記憶體模組(RDIMM, SODIMM, VLPDIMM, UDIMM及其他) |
| 檢測速度 (2D+3D): | 50cm2/sec |
| 最小元件尺寸: | 0402mm (01005 in.) |
| 板長: | 最小25mm /最大140mm |
| 板寬: | 最小17mm /最大35mm |
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SE3000/SE3000-X/SE3000-XL錫膏測厚儀(SPI)
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