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Electronic Assembly Line Auxiliary Systems

Electronic Assembly Line Auxiliary Systems » CyberOptics » 锡膏测厚仪(SPI)

SE600锡膏测厚仪(SPI)

检测应用 (2D+3D) 锡膏和SMD胶水
检测速度 (2D+3D): 最高: 108cm2/sec和平均: 80 cm2/sec@30um; 最高: 56cm2/sec和平均: 30 cm2/sec@15um
线路板: SE600: 50x50mm – 510x510mm;
SE600-X: 100x100mm – 710x610mm
测量 Gage R&R <2%@6σ(使用校正板)
高度精准度: 使用校正板是2um
CATEGORY
CyberOptics
SUB-CATEGORY
锡膏测厚仪(SPI)

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