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Electronic Assembly Line Auxiliary Systems

Electronic Assembly Line Auxiliary Systems » Cyberoptics » 記憶體成品外觀檢測(FVI)

MX3000 3D AOI記憶體成品外觀檢測

檢測應用 (2D+3D) 各種外型記憶體模組(RDIMM, SODIMM, VLPDIMM, UDIMM及其他)
檢測速度 (2D+3D): 50cm2/sec
最小元件尺寸: 0402mm (01005 in.)
板長: 最小25mm /最大140mm
板寬: 最小17mm /最大35mm
CATEGORY
Cyberoptics
SUB-CATEGORY
記憶體成品外觀檢測(FVI)

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