Electronic Assembly Line Auxiliary Systems

VisionPro AP series (Available models: APSP3D, VisionPro AP300 & VisionPro AP500)

VisionPro AP series is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows user interface, and packaged in a rugged, tabletop system designed for the electronics production floor.  With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA’s and many other PCB features.  VisionPro AP series completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Key Features & Benefits

• Multiple Sensor Options: SP3D & PSI
• Automated Height, Area, Volume, Offset
• Gerber Programming & Auto-Scripting
• Defect Error Review
• Built-in Data and SPC Charting
• Color 3D Profiles of Measured Features
• ASCan Ultra Measurement Software