电子组装生产线设备

Through Mold Via (TMV), Package on Package (PoP), eWLP, CSP, LGA, CVBGA, CABGA, CTBGA, PBGA, SBGA, Flip Chips (FC), Micro Lead Frame (MLF, QFN), CQFP, QFP, TQFP, LQFP, PLCC, SOIC, TSOP, SSOP, TSSOP, Resistor (SMR), Capacitors (SMC), Through-Hole