Electronic Assembly Line Auxiliary Systems

Inspection Application (2D+3D) Geometric coordinates measurement, e.g. CPU socket, Packaging, Solder Bumps, Parts, etc. Inspection speed (2D+3D): 50cm2/sec to 15 cm2/sec (depends on MRS sensor type) Minimum features size: 100μm or 70 μm (depends on MRS sensor type) XY R&R@1σ: <3μm or <2μm (depends on MRS sensor type) Z R&R@1σ: <2μm Accuracy XY: 6μm or 5μm (depends on MRS sensor type) Accuracy Z: 2μm