Electronic Assembly Line Auxiliary Systems

Inspection Application (2D) SMT, PHT, Gold Finger,etc. Inspection speed (2D): 200cm2/sec Minimum component size: 0402mm(01005 in.) PCB size: 50x50mm – 330x320mm

Inspection Application (2D) SMT, PHT, Gold Finger,etc. Inspection speed (2D): 200cm2/sec Minimum component size: 0402mm(01005 in.) PCB size: 50x50mm – 400x308mm Measurement Gage R&R: <10% (Down to 0402mm component)

Inspection Application (2D) SMT, PHT, Gold Finger,etc. Inspection speed (2D): 110cm2/sec Minimum component size: 0402mm(01005 in.) PCB size: 50x50mm – 400x308mm

Inspection Application (2D) SMT, PHT, Gold Finger,etc. Inspection speed (2D): 200cm2/sec Minimum component size: 0402mm(01005 in.) PCB size: QX600: 50x50mm – 400x308mm QX600-L: 50x50mm – 470x510mm QX600-D: 520x300mm/520x510mm Measurement Gage R&R: <10% (Down to 0402mm component)

Inspection Application (2D): Lens, Packaging, Wire Bonding, etc. Field of View: 15x15mm Resolution: 3um Inspection speed (2D): 7cm2/sec

Inspection Application (2D+3D) SMT, PHT, Gold Finger,etc. Inspection speed (2D+3D): 50cm2/sec to 15 cm2/sec (depends on MRS sensor type) Minimum component size: 0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type) PCB size: SQ3000: 50x50mm – 510x510mm SQ3000+: 50x50mm – 420x320mm SQ3000-X: 50x120mm – 720x620mm Measurement Gage R&R: <10%@±3σ (±80μm process tolerance) Height accuracy: 1 μm on Certification Target

Inspection Application (2D+3D): SMT, PHT, Gold Finger,etc. Inspection speed (2D+3D): 50cm2/sec to 15 cm2/sec (depends on MRS sensor type) Minimum component size: 0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type) PCB size (Max.): SQ3000-DD: Single Lane: 510x510mm; Dual Lane: 350x320mm SQ3000-D: Single Lane: 510x510mm; Dual Lane: 510x320mm Measurement Gage R&R: <10%@±3σ (±80μm process tolerance) Height accuracy: 1 μm on Certification Target